Label Value
DOI 10.1007/s11340-017-0258-2
TITLE Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep
TYPE article
PUBLICATION DATE
Service Status Date Last Checked
Scopus Yes 2017-08-21T11:23:10.475199+00:00
Web of Science Yes 2018-04-08T08:48:40.411873
Compendex Yes 2019-05-29T09:25:09.590497